767484

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

Manufacturer: Sigma Aldrich

CAS Number: 7440-02-0

Select a Size

Pack Size SKU Availability Price
1 EA 767484-1-EA In Stock ₹ 25,960.00

767484 - 1 EA

₹ 25,960.00

In Stock

Quantity

1

Base Price: ₹ 25,960.00

GST (18%): ₹ 4,672.80

Total Price: ₹ 30,632.80

Quality Level

100

Assay

99.95% trace metals basis

form

solid

reaction suitability

core: nickel

resistivity

6.97 μΩ-cm, 20°C

diam. × thickness

2.00 in. × 0.25 in.

bp

2732 °C (lit.)

mp

1453 °C (lit.)

density

8.9 g/mL at 25 °C (lit.)

SMILES string

[Ni]

Other Options

Image Product Name Manufacturer Price Range
Sigma Aldrich Fine Chemicals Biosciences Nickel foil, thickness 0.125 mm, >=99.9% | 7440-02-0 | MFCD00011137 | 25G
-- ₹ 10,795.96
Strem, An Ascensus Company CAS# 7440-02-0. 250g. Nickel pellets (99.9%). MFCD00011137
-- ₹ 8,213.76
Strem, An Ascensus Company CAS# 7440-02-0. 30cm. Nickel rod (99+%). MFCD00011137
-- ₹ 10,369.87
Sigma Aldrich Fine Chemicals Biosciences Nickel tube, 500mm, outside diameter 3.0mm, inside diameter 2.4mm, wall thickness 0.3mm, hard, 99.5% | 7440-02-0 | MFCD00011137 | 1EA
-- ₹ 43,327.58
Strem, An Ascensus Company CAS# 7440-02-0. 120cm. Nickel tubing (99.5%). MFCD00011137
-- ₹ 10,677.89
Strem, An Ascensus Company CAS# 7440-02-0. 50m. Nickel wire (99+%). MFCD00011137
-- ₹ 21,458.45
Strem, An Ascensus Company CAS# 7440-02-0. 300 x 600mm. Nickel wire cloth, 34 x 34 mesh. MFCD00011137
-- ₹ 7,597.73
Sigma Aldrich Fine Chemicals Biosciences Raney(R)-Nickel W.R. Grace and Co. Raney(R)4200, slurry, in H2O, active catalyst | 7440-02-0 | MFCD00167392 | 100G
-- ₹ 11,215.20
Sigma Aldrich Fine Chemicals Biosciences Raney(R)-Nickel W.R. Grace and Co. Raney(R)2800, slurry, in H2O, active catalyst | 7440-02-0 | MFCD00167392 | 100G
-- ₹ 10,900.34
Sigma Aldrich Fine Chemicals Biosciences Raney(R)-Nickel W.R. Grace and Co. Raney(R)2800, slurry, in H2O, active catalyst | 7440-02-0 | MFCD00167392 | 500G
-- ₹ 27,250.86
...

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Description

  • Application: Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

SAFETY INFORMATION

Pictograms

GHS08,GHS07

Signal Word

Danger

Hazard Statements

H317,H351,H372

Precautionary Statements

P202 - P260 - P264 - P280 - P302 + P352 - P308 + P313

Hazard Classifications

Carc. 2 - Skin Sens. 1 - STOT RE 1

WGK

WGK 2

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable